1.5g Aluminum oxide/silicone based S606C thermal transfer compound in a mini syringe. Designed to move heat away from sensitive components. Fills in tiny gaps between Heatsink & part. Will not dryout, harden or separate.
Max. operating temperature: 180C
Thermal conductivity of 5 W/m.K.
Thermal Resistance: .011-.017 C-in/W
Volume Resistance: >10E12 (>1012) ohm/cm
WT: 3gm
