Sold in packs of 10
Silicone/Kapton pad used to provide better heat conductivity & Dielectric isolation between heatsink/mounting Base and a TO-3 case device.. Thermal Conductivity: 0.9 W/m-k
Thermal Performance: 3.4deg.C°/W @ 25PSI
Dielectric Breakdown: 6000VAC
L: 1-5/8" W: 1-1/8" T: .006" WT: .001/Pack of 10
