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830 Tie Point Solderless Breadboard, Unmounted

830 Tie Point Solderless Breadboard, Unmounted

24443-large.jpg  360-3D.jpg 
Stock No: 24443 TE
  
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 Detailed Description
830 tie point solderless breadboard with 2 distribution strips. Features: ABS plastic body, Nickel plated contacts Rated 2A Max. Contact resistance less than 1 milliohm @ 1kHz. Tested for over 10,000 cycles. Snap lock molded dove-tail for combining multiple boards. Suitable for 19-29 AWG wire and all DIP size components.
See 32893 for the solder protoboard that matches the buss & hole patterns
L: 6-1/2" W: 2-1/8" H: 3/8" WT: .3




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